Wafer and Mishka cutting machine (electric – automatic)

**Features of the Cake Leveling Machine:** - Full stainless steel body - Single-phase power consumption - PLC-based system - Designed for leveling cakes with pastry cream - Rotating plate with a diameter of 40 cm - Capable of leveling various types of gift (refrigerated) cakes with different diameters and heights - Equipped with two stainless steel blades on horizontal and vertical axes for smoothing the cake surface - Machine dimensions: 65 cm in length, 45 cm in width, and 70 cm in height - Axes of the machine are intelligently moved forward and backward using a manual handwheel **How to Use the Machine:** 1. Place the cake on the rotating plate of the machine. 2. Adjust the vertical and horizontal axes to the thickness of the cream and bring them close to the cake. 3. Inject the cream onto the cake surface using a fabric funnel. 4. The two blades will smooth the cream on the cake surface. 5. At the end of the process, press the return-to-original-position button and remove the cake from the rotating plate.

* For cutting roulettes (simple and angled) and dessert cakes in different sizes and thicknesses (square, rectangular, rhombus and triangle)

  * This machine is for cutting all kinds of wafers and Mishka * The blade bases of the machine

* To measure dry dough – tart and chickpea * In two types of spiral and ball (roller) * Dimensions